density. Since many designs included considerably more SRAM than logic - a common ratio being 70% SRAM to 30% logic = die shrinks were expected to be around 26%. TSMC was planning volume production in the second half of 2022.

In July 2021, Intel presented brand new process technology roadmap, according to which "Intel 3" process (previously named Intel 7+), the company's second node to use EUV and the last one to use FinFET before switching to Intel's RibbonFET transistor architecture, was scheduled