CEA-Leti also developed monolithic 3D IC approaches, called sequential 3D IC. In 2014, the French research institute introduced its CoolCube(TM), a low-temperature process flow that provides a true path to 3DVLSI.

At Stanford University, researchers designed monolithic 3D ICs using carbon nanotube (CNT) structures vs. silicon using a wafer-scale low temperature CNT transfer processes that can be done at 120 °C.

Manufacturing technologies for 3D SiCs

There are several methods for 3D IC design, including

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