was commercialized by Samsung Electronics in 2013.

3D integrated circuit technology

3D integrated circuit (3D IC) technology stacks integrated circuit (IC) chips vertically into a single 3D IC package. Toshiba introduced 3D IC technology to NAND flash memory in April 2007, when they debuted a 16GB eMMC compliant (product number THGAM0G7D8DBAI6, often abbreviated

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