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<p>way to the electrical case.</p>

<p><big> Thermal interface material </big></p>
<p>A <b>thermal interface material or mastic</b> ( <b>TIM</b>) is used to fill the gaps between <a href="page.php?w=thermal_transfer">thermal transfer</a> surfaces, such as between <a href="page.php?w=microprocessor">microprocessor</a>s and <a href="page.php?w=heatsink">heatsink</a>s, in order to increase thermal transfer <a href="page.php?w=thermodynamic_efficiency">efficiency</a>.It has a higher thermal conductivity value in Z-direction than xy-direction.</p>

<p><big>Applications</big></p><p>
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