the revised storage control unit chip is also smaller. A goal for the six-chip configuration was to reduce cost, and therefore the chips are packaged in a solder ball connect (SBC) package instead of a MCM.

POWER2 Super Chip (P2SC)

POWER2 Super Chip (P2SC) was released in October 1996 as the successor of the POWER2. It was a single-chip implementation of the eight-chip POWER2, integrating 15 million transistors on a 335 mm² die manufactured in IBM's 0.29 um five-layer

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