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have introduced new 3D or stacked architectures. Following the introduction of its 28 nm 7-series FPGAs, Xilinx revealed that several of the highest-density parts in those FPGA product lines will be constructed using multiple dies in one package, employing technology developed for 3D construction and stacked-die assemblies. The technology stacks several (three or four) active FPGA dice side-by-side on a silicon interposer - a single piece of silicon that carries passive interconnect. The multi-die

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