where the rise in temperature should not exceed a specified temperature per second, such as 2 °C/s. Rapid evaporation of the flux contained in the solder paste can lead to defects, such as lead lift, tombstoning, and solder balls. Additionally, rapid heat can lead to steam generation within the component if the moisture content is high, resulting in the formation of microcracks.

In the soak segment of the profile, the solder paste approaches a phase change. The amount of energy introduced to both the component and the PCB