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<p>cases can often be improved by blocking of selected holes.<br/>
* <b>Poor heat transfer</b> due to poor thermal contact between components to be cooled and cooling devices. This can be improved by the use of thermal compounds to even out surface imperfections, or even by lapping.</p>

<p><big>Damage prevention</big></p>
<p>Because high temperatures can significantly reduce life span or cause permanent damage to components, and the heat output of components can sometimes exceed the computer's cooling capacity, manufacturers often take additional precautions</p><p>
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