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<p>A <b>Flip-Chip module</b> is a component of digital logic systems made by the <a href="page.php?w=Digital_Equipment_Corporation">Digital Equipment Corporation</a> (DEC) for its <a href="page.php?w=PDP-7">PDP-7</a>, <a href="page.php?w=PDP-8">PDP-8</a>, <a href="page.php?w=PDP-9">PDP-9</a>, and <a href="page.php?w=PDP-10">PDP-10</a> computers, and related <a href="page.php?w=peripheral">peripheral</a>s, beginning on August 24, 1964.</p>

<p><big>Description</big></p>
<p>As used by DEC, the term described a proprietary way to package electronic circuitry</p><p>
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