The DDR4 specification will include standardized 3D stacking "from the start" according to JEDEC, with provision for up to dies. X-bit Labs predicted that "as a result DDR4 memory chips with very high density will become relatively inexpensive".

Switched memory banks are also an anticipated option for servers.

In 2008, the book Wafer Level 3-D ICs Process Technology highlighted concerns about the increasing die area consumption due to non-scaling analog elements like

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